Custom Rigid-flex Printed Circuit Boards FPC PCB Manufacturer
Board thickness: 1.6mm
Surface treatment: Immersion Gold
Technology: Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment: L/C,T/T,Western Union
Certification: UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term： 5-6 Business Days
Background
ITEL's rigid multilayer PCBs can contain plated and non-plated through hole and blind & buried vias. Multilayer PCBs are produced with FR4 or higher quality base materials. As standard, a maximum of 18 layers are used and PCB thicknesses in the range of 0.6 mm to 3.2 mm are realised.
GigaDevice's Parallel NAND Flash complies with ONFI 1.0 protocol. The product provides 1Gb to 8Gb density options. It supports either 3V or 1.8V voltage, and x8 or x16 I/O interfaces, as well as mainstream packages such as TSOP48 and BGA63. GigaDevice Parallel NAND Flash is a showcase based on the company’s proven design philosophy and its commitment to independent design ability. The incorporation of innovative breakthroughs and rigorous quality control standards throughout the product’s design provides industrial, communication, and consumer electronic applications with a wide range of high-speed and high-reliability solutions.
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