Professional Optional plating gold pcb gold finger pcb gold plated pcb
Material: FR4
Board thickness: 1.6mm
Surface treatment: Immersion Gold，Plated Gold
Technology: Long-short gold finger, gold plating, electroplated finger
Payment: L/C,T/T,Western Union
Certification: UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term： DDU, FOB, CFA, CIF, CPT, EXW
Background
ITEL's rigid multilayer PCBs can contain plated and non-plated through hole and blind & buried vias. Multilayer PCBs are produced with FR4 or higher quality base materials. As standard, a maximum of 18 layers are used and PCB thicknesses in the range of 0.6 mm to 3.2 mm are realised.
GigaDevice's Parallel NAND Flash complies with ONFI 1.0 protocol. The product provides 1Gb to 8Gb density options. It supports either 3V or 1.8V voltage, and x8 or x16 I/O interfaces, as well as mainstream packages such as TSOP48 and BGA63. GigaDevice Parallel NAND Flash is a showcase based on the company’s proven design philosophy and its commitment to independent design ability. The incorporation of innovative breakthroughs and rigorous quality control standards throughout the product’s design provides industrial, communication, and consumer electronic applications with a wide range of high-speed and high-reliability solutions.
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